Atharv Jog

Publications

• Novel Advanced Low-k Dielectric for 2 nm and Beyond Cu and Post Cu Dual Damascene BEOL Interconnect Technologies

  • • Son Nguyen
    • Huai Huang
    • et al.
  • 2025
  • VLSI Technology and Circuits 2025

• The Extreme Extendibility of Cu and Post-Cu Dual Damascene BEOL Interconnect Technology

  • • Daniel Edelstein
    • Son Nguyen
    • et al.
  • 2024
  • IEDM 2024