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PaperMichael Hatzakis, semiconductor industry pioneerJ. Paraszczak, J.M. Shaw, et al.Micro and Nano Engineering
Conference paperCoupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systemsBiancun Xie, Madhavan Swaminathan, et al.EMC 2011
PaperIon beam patterning of block copolymer thin filmsRanulfo Allen, John Baglin, et al.J. Photopolym. Sci. Tech.
