C. Wang, S.W. Nam, et al.
IEDM 2013
In this paper we report on a comprehensive study of Silicon-Germanium channel (cSiGe) physics, layout effects and impact on device performance. This work demonstrates a 2nd generation of dual channel technology, which meets the 22nm high performance technology (HP) requirement. Modeling and simulation are used to optimize the process to obtain a 10% Short Channel Effect (SCE) improvement and an overall 20% performance enhancement. This 2 nd generation high performance dual channel process has been integrated into a manufacturable and yieldable technology, thereby providing a solid platform for introduction of SiGe FinFet technology. © 2013 IEEE.
C. Wang, S.W. Nam, et al.
IEDM 2013
John G. Long, Peter C. Searson, et al.
JES
Kafai Lai, Alan E. Rosenbluth, et al.
SPIE Advanced Lithography 2007
E. Burstein
Ferroelectrics