Lukas Kull, Danny Luu, et al.
ISSCC 2017
The rapid increase of bandwidth requirements between processors in high-end servers motivates the integration of optical interconnects on the first-level processor package [1]. In this perspective, additional bandwidth density can be achieved by integrating optical transceivers directly into the processor die. Optically enabled CPUs can provide energy-efficient, low-latency interconnects over long distances (>10m) in future data-centers. Integrated photonic interconnect technology will require sensitive and low-power receiver (RX) circuits that operate at high data rates.
Lukas Kull, Danny Luu, et al.
ISSCC 2017
Alessandro Cevrero, Ilter Ozkaya, et al.
ISSCC 2019
Ilter Ozkaya, Alessandro Cevrero, et al.
IEEE JSSC
Marcel Kossel, Christian Menolfi, et al.
ESSCIRC 2017