Conference paperCoupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systemsBiancun Xie, Madhavan Swaminathan, et al.EMC 2011
PaperLigand-stabilized copper(I) hexafluoroacetylacetonate complexes: NMR spectroscope and the nature of the copper-alkene bondThomas H. Baum, Carl E. Larson, et al.Journal of Organometallic Chemistry
PaperMichael Hatzakis, semiconductor industry pioneerJ. Paraszczak, J.M. Shaw, et al.Micro and Nano Engineering
