Conference paper3D Die-Stack on Substrate (3D-DSS) Packaging Technology and FEM Analysis for 55um-75um Mixed Pitch Interconnections on High Density Laminate Katsuyuki Sakuma, Mukta Farooq, et al.ECTC 2021
Conference paperSolving optimization tasks power-efficiently exploiting VO2's phase-change properties with Oscillating Neural NetworksOlivier Maher, N. Harnack, et al.DRC 2023
Conference paperADaComP: Adaptive residual gradient compression for data-parallel distributed trainingChia-Yu Chen, Jungwook Choi, et al.AAAI 2018
Conference paperReliable Chiplet Integration on High Density Laminate (2.X D) for AI HardwareDivya Taneja, Jonathan Grenier, et al.ECTC 2024
