Conference paperNEW RELIABLE STRUCTURE FOR HIGH TEMPERATURE MEASUREMENT OF SILICON WAFERS USING A SPECIALLY ATTACHED THERMOCOUPLE.S. Cohen, T.O. Sedgwick, et al.MRS Proceedings 1983
PaperThermally Developable, Positive Resist Systems with High SensitivityHiroshi Ito, Reinhold SchwalmJES
PaperThe boundary contour method for three-dimensional linear elasticityA. Nagarajan, S. Mukherjee, et al.Journal of Applied Mechanics, Transactions ASME