Scripta Metallurgica

Paper

01 Jan 1970

Coincidence diffraction

View publication

Abstract

No abstract available.

Paper

Low temperature gettering of Cu, Ag, and Au across a wafer of Si by Al

R.D. Thompson, K.N. Tu

Applied Physics Letters

Paper

Low-temperature amorphous-to-crystalline transformation of CoSi₂ films

A. Cros, K.N. Tu, et al.

Applied Physics Letters

Paper

Dependence of the decoupling temperature of Tl₂Ba₂Ca₂Cu₃O_10-δ (O< δ < 0.15) on applied magnetic field and oxygen stoichiometry

R.S. Liu, S.Y. Lin, et al.

Physica C: Superconductivity and its applications

Paper

Mechanism of electromigration-induced failure in flip-chip solder joints with a 10-μm-thick Cu under-bump metallization

Jae-Woong Nah, Kai Chen, et al.

Journal of Materials Research

View all publications