PaperElectromigration and transport reversal in copper-silver thin filmsA. Gangulee, F.M. d'HeurleJournal of Physics and Chemistry of Solids
PaperInterdiffusion in Ni/Au and Ni-Fe/Au thin film diffusion couplesA. GanguleeJapanese Journal of Applied Physics
PaperStructure of electroplated and vapor-deposited copper films. II. Effects of annealingA. GanguleeJournal of Applied Physics
PaperAnnealing behavior of electroplated permalloy thin films. IIA. Gangulee, R.L. AndersonJournal of Electronic Materials