PaperSilylation of resist materials using di- and polyfunctional organosilicon compoundsE. Babich, J. Paraszczak, et al.Microelectronic Engineering
Conference paperCoupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systemsBiancun Xie, Madhavan Swaminathan, et al.EMC 2011
PaperFabrication of Si/SiGe quantum point contacts by electron-beam lithography and shallow wet-chemical etchingU. Wieser, U. Kunze, et al.Physica E: Low-Dimensional Systems and Nanostructures
