Conference paper
Reduced Cu interface diffusion by CoWP surface coating
C.-K. Hu, L. Gignac, et al.
Microelectronic Engineering
In a study of the TDDB performance of an ultra-low-k (ULK) dielectric (JSR 5537 k = 2.3) it was found that the presence of moisture significantly reduced the TDDB lifetime as well as increased leakage and capacitance. It was also observed that the field coefficient (γ) in an "E" TDDB lifetime model was significantly larger in "dry" samples than in "wet" samples. © 2005 IEEE.
C.-K. Hu, L. Gignac, et al.
Microelectronic Engineering
R.F. Liu, C.-K. Hu, et al.
Journal of Applied Physics
N. Inoue, F. Ito, et al.
IITC 2013
M.Y. Chern, A. Gupta, et al.
Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films