James D. Meindl, Jeffrey A. Davis, et al.
IBM J. Res. Dev
It is well known that electromigration (EM) time-to-failure for ac is several orders of magnitude larger than for dc. We propose a novel technique that reverses current direction in the power delivery system of a microprocessor every time it is rebooted. This improves EM time-to-failure of solder bumps and on-chip global interconnects and vias in the power delivery system. © 2007 IEEE.
James D. Meindl, Jeffrey A. Davis, et al.
IBM J. Res. Dev
Bing Dang, Chirag Patel, et al.
IITC 2004
Deepak Sekar, Calvin King, et al.
IITC 2008
Italo Buleje, Vince Siu, et al.
ICDH 2023