P. Manuel, G.A. Sai-Halasz, et al.
Physical Review Letters
The recently observed enhancement in adhesion between Cu and Teflon due to a presputtering treatment of Teflon prior to the Cu deposition is analyzed. The sputtering treatment resulted in a morphology change of the Teflon, with the deposited Cu showing similar textures, and changes in chemical bondings between the two. A simple geometric model is used to analyze the contribution from the morphology changes to the observed peel strength. It is shown that, for a finite chemical bonding, an appreciable contribution to the peel strength is possible from the morphology changes observed.
P. Manuel, G.A. Sai-Halasz, et al.
Physical Review Letters
Chin-An Chang
Journal of Applied Physics
Q.Y. Ma, E.S. Yang, et al.
Applied Physics Letters
Chin-An Chang
Applied Physics Letters