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Conference paperCoupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systemsBiancun Xie, Madhavan Swaminathan, et al.EMC 2011
PaperFabrication of Si/SiGe quantum point contacts by electron-beam lithography and shallow wet-chemical etchingU. Wieser, U. Kunze, et al.Physica E: Low-Dimensional Systems and Nanostructures