Donald Samuels, Ian Stobert
SPIE Photomask Technology + EUV Lithography 2007
Variations in highly scaled (LG = 9nm), undoped-channel FinFET performance, caused by statistical dopant fluctuations (SDFs) in the source/drain (S/D) gradient regions, are systematically investigated using 3-D atomistic device simulations. The impact of SDF on device design optimization is examined and simple design strategies are identified. Variation-tolerant design imposes stringent specifications for S/D lateral abruptness and gate-sidewall spacer thickness, and it poses a tradeoff between performance and variability for body thickness. © 2006 IEEE.
Donald Samuels, Ian Stobert
SPIE Photomask Technology + EUV Lithography 2007
Kaoutar El Maghraoui, Gokul Kandiraju, et al.
WOSP/SIPEW 2010
Preeti Malakar, Thomas George, et al.
SC 2012
Thomas M. Cover
IEEE Trans. Inf. Theory