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PaperParametric Modeling for Survival with Competing Risks and Masked Failure CausesBetty J. Flehinger, Benjamin Reiser, et al.Lifetime Data Analysis
Conference paperMinimum void size and 3-parameter lognormal distribution for em failures in Cu interconnectsBaozhen Li, Cathryn Christiansen, et al.IRPS 2006
PaperModeling and forecasting of defect-limited yield in semiconductor manufacturingMichael Baron, Asya Takken, et al.IEEE Trans Semicond Manuf
