Jeffrey O. Kephart, Hoi Chan, et al.
ICAC 2007
Accurate estimation of leakage power at runtime requires post-silicon power measurements across a wide range of temperature and voltage conditions. Testing individual chips, especially at high-temperature corner conditions, is expensive in cost and time. We examine this problem in an industrial context and introduce FreqLeak, a frequency step based method for inexpensive and efficient leakage power characterization in a system. It enables a more thorough characterization than can be accomplished on a wafer prober alone due to time and equipment costs. Experimental evaluation on IBM POWER8 based systems demonstrates the efficiency of the proposed method, within an error of 5%. Further, we discuss the application of FreqLeak in system level power management.
Jeffrey O. Kephart, Hoi Chan, et al.
ICAC 2007
Rajarshi Das, Gerald Tesauro, et al.
AAMAS 2008
Xiaorui Wang, Ming Chen, et al.
PACT 2009
Giulio Antonhi, Albert E. Ruehlis, et al.
IEEE Topical Meeting EPEPS 2003