Conference paperCoupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systemsBiancun Xie, Madhavan Swaminathan, et al.EMC 2011
PaperHarmonic analysis in rheological property measurementThomas E. Karis, C. Mark Seymour, et al.Rheologica Acta
PaperSynthesis of 1,2,4-Triazole Poly(aryl ethers) via Heterocyclic-Activated Displacement PolymerizationKenneth R. Carter, Robert D. Miller, et al.Macromolecules
PaperThe Etching of Crystallographically Determined Orifices in SapphireA. Reisman, M. Berkenblit, et al.JES