Conference paper
Voids-free Die-level Cu/ILD Hybrid bonding
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ECTC 2023
This paper discusses the current and future needs in continued CMOS scaling, reviews the status of the transfer and joining (TJ) technology for MCM-D and wafer level 3DI integration, and explores the opportunities of the TJ technology in the realm of the "More than Moore" era. © 2008 IEEE.
Katsuyuki Sakuma, Roy Yu, et al.
ECTC 2023
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