S.M. Schramm, A.B. Pang, et al.
Ultramicroscopy
Medium energy ion scattering, combined with the effects of channeling and blocking, is a powerful technique for the nondestructive analysis of the structure of surfaces and interfaces with high depth resolution (typically 3-5 A). This paper discusses the principles of the technique and illustrates these with recent experimental results obtained on UHV prepared clean silicon surfaces and silicon-metal interfaces.
S.M. Schramm, A.B. Pang, et al.
Ultramicroscopy
J. Falta, M. Copel, et al.
Physical Review B
R.M. Tromp, R.J. Hamers, et al.
Physical Review Letters
J. Sun, J.B. Hannon, et al.
IBM J. Res. Dev