C.M. Brown, L. Cristofolini, et al.
Chemistry of Materials
Electronic data center cooling using hot water is proposed for high system exergetic utility. The proof-of-principle is provided by numerically modeling a manifold micro-channel heat sink for cooling microprocessors of a data center. An easily achievable 0.5l/min per chip water flow, with 60°C inlet water temperature, is found sufficient to address the typical data center thermal loads. A maximum temperature difference of ~8°C was found between the solid and liquid, confirming small exergetic destruction due to heat transport across a temperature differential. The high water outlet temperature from the heat sink opens the possibility of waste heat recovery applications.
C.M. Brown, L. Cristofolini, et al.
Chemistry of Materials
S.F. Fan, W.B. Yun, et al.
Proceedings of SPIE 1989
A. Gupta, R. Gross, et al.
SPIE Advances in Semiconductors and Superconductors 1990
Thomas E. Karis, C. Mark Seymour, et al.
Rheologica Acta