I am privileged to have been coauthor with Doug

F.J. Himpsel, T.A. Jung, et al.

Surface Review and Letters

Thomas E. Karis, C. Mark Seymour, et al.

Rheologica Acta

Joy Y. Cheng, Daniel P. Sanders, et al.

SPIE Advanced Lithography 2008

R.D. Murphy, R.O. Watts

Journal of Low Temperature Physics