Ellen J. Yoffa, David Adler
Physical Review B
We review some opto-electronic devices based on the III-V/SOI heterogeneous integration platform, including lasers, modulators, wavelength converters, and photo-detectors. All of them are critical components for future on-chip interconnect and optical network-on-chip. The footprints of such devices are kept small by employing micro-cavity based structures. We give an overview of the device performances. The advantages over the all-silicon based devices are also discussed. Copyright © 2010 American Scientific Publishers All rights reserved.
Ellen J. Yoffa, David Adler
Physical Review B
R.J. Gambino, N.R. Stemple, et al.
Journal of Physics and Chemistry of Solids
R. Ghez, M.B. Small
JES
R.D. Murphy, R.O. Watts
Journal of Low Temperature Physics