W.-Y. Lee, H. Coufal, et al.
JVSTA
The key unit processes outlined are chemical vapor deposition, oxidation, diffusion and ion implantation, metallization and lithography. The most critical advances have been in lithography and etching, where electron-beam systems along with plasma-assisted etching techniques, have enabled further miniaturization. New materials have been developed including low resistivity silicides. The interaction of computer aided design, process simulation, production/process control, in-process measurement, characterization and final testing play a critical role in VLSI fabrication technology.