Ming L. Yu, Ho-Seob Kim, et al.
Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
The use of the thermoelectric voltage generated between the tip and the wire during laser wirebonding is described as a process monitor. The change in thermoelectric response during melting of the wire is detected and used to control the laser pulselength. Thus, optimum bonding is achieved independent of thermal environment at different pad locations. The use of the process monitor for bonding on gold pads on multilayer alumina substrates is described in detail. © 1995 IEEE
Ming L. Yu, Ho-Seob Kim, et al.
Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Ming L. Yu, Norton D. Lang, et al.
Physical Review Letters
Guo-Qiang Gong, Chadwick Canedy, et al.
Applied Physics Letters
Emanuel I. Cooper, Edward A. Giess, et al.
Materials Letters