PaperA High-Density, Four-Channel, OEIC Transceiver Module Utilizing Planar-Processed Optical Waveguides and Flip-Chip, Solder-Bump TechnologyK. Jackson, E.B. Flint, et al.Journal of Lightwave Technology
Conference paperAGING RESPONSE AND CRYOGENIC MECHANICAL PROPERTIES OF AN In-Sn EUTECTIC SOLDER ALLOY FOR JOSEPHSON PACKAGING.T. Caulfield, S. Purushothaman, et al.International Cryogenic Materials Conference 1983
PaperCryogenic temperature mechanical behavior of solid mercuryS. Purushothaman, T. CaulfieldJournal of Applied Physics
