Conference paperNEW RELIABLE STRUCTURE FOR HIGH TEMPERATURE MEASUREMENT OF SILICON WAFERS USING A SPECIALLY ATTACHED THERMOCOUPLE.S. Cohen, T.O. Sedgwick, et al.MRS Proceedings 1983
PaperGlassy behaviour in high-Tc superconductorsI. Morgenstern, K.A. Müller, et al.Physica B: Physics of Condensed Matter
PaperAF-Net: An Active Fire Detection Model Using Improved Object-Contextual Representations on Unbalanced UAV DatasetsXikun Hu, Wenlin Liu, et al.IEEE J-STARS
PaperElectrochemical characterization of adsorption-desorption of the cuprous-suppressor-chloride complex during electrodeposition of copperJohn G. Long, Peter C. Searson, et al.JES