Eloisa Bentivegna
Big Data 2022
Recent studies show that plasma abatement is a practical alternative to thermal abatement devices for reducing fluorocarbon (FC) emissions from dielectric etch processes, with significantly lower CoO. Point-of-use (POU) plasma abatement devices attain high FC destruction and removal efficiency (DRE) with no process impacts and produce simple, low-molecular-weight, water-scrubble by-products.
Eloisa Bentivegna
Big Data 2022
Sang-Min Park, Mark P. Stoykovich, et al.
Advanced Materials
B.A. Hutchins, T.N. Rhodin, et al.
Surface Science
D.D. Awschalom, J.-M. Halbout
Journal of Magnetism and Magnetic Materials