Michael Ray, Yves C. Martin
Proceedings of SPIE - The International Society for Optical Engineering
Recent studies show that plasma abatement is a practical alternative to thermal abatement devices for reducing fluorocarbon (FC) emissions from dielectric etch processes, with significantly lower CoO. Point-of-use (POU) plasma abatement devices attain high FC destruction and removal efficiency (DRE) with no process impacts and produce simple, low-molecular-weight, water-scrubble by-products.
Michael Ray, Yves C. Martin
Proceedings of SPIE - The International Society for Optical Engineering
Ranulfo Allen, John Baglin, et al.
J. Photopolym. Sci. Tech.
Arvind Kumar, Jeffrey J. Welser, et al.
MRS Spring 2000
J.K. Gimzewski, T.A. Jung, et al.
Surface Science