250 Gbps 10-channel WDM silicon photonics receiver
Huapu Pan, Solomon Assefa, et al.
GFP 2012
To satisfy the intra- and inter-system bandwidth requirements of future data centers and high-performance computers, low-cost low-power high-throughput optical interconnects will become a key enabling technology. To tightly integrate optics with the computing hardware, particularly in the context of CMOS-compatible silicon photonics, optical printed circuit boards using polymer waveguides are considered as a formidable platform. IBM Research has already demonstrated the essential silicon photonics and interconnection building blocks. A remaining challenge is electro-optical packaging, i.e., the connection of the silicon photonics chips with the system. In this paper, we present a new single-mode polymer waveguide technology and a scalable method for building the optical interface between silicon photonics chips and single-mode polymer waveguides.
Huapu Pan, Solomon Assefa, et al.
GFP 2012
Marc Seifried, Herwig Hahn, et al.
ICTON 2017
Jan-Marc Lehky, Daniel Erni, et al.
LEOS 2005
Roger Dangel, Antonio La Porta, et al.
IEEE JSTQE