Power supply noise analysis methodology for deep-submicron VLSI chip design

This paper describes a new design methodology to analyze the on-chip power supply noise for high-performance microprocessors. Based on an integrated package-level and chip-level power bus model, and a simulated switching circuit model for each functional block, this methodology offers the most complete and accurate analysis of Vdd distribution for the entire chip. The analysis results not only provide designers with the inductive ΔI noise and the resistive IR drop data at the same time, but also allow designers to easily identify the hot spots on the chip and ΔV across the chip. Global and local optimization such as buffer sizing, power bus sizing, and on-chip decoupling capacitor placement can then be conducted to maximize the circuit performance and minimize the noise.