Surface cleaning by electrostatic removal of particles
Douglas W. Cooper, H.L. Wolfe, et al.
Annual Technical Meeting of Institute of Environmental Sciences 1989
A thin films fabrication facility using minienvironments and product-handling automation was benchmarked to determine the extent to which isolating products from the cleanroom avoids contamination. Data were collected from tests that simulated production conditions while controlling random variables. The study found that isolation factors of at least 1000 were demonstrated by settling wafer data, and 10,000 by aerosol data. In general, lowered room airflow did not significantly degrade minienvironment cleanliness. In addition, the study investigated reliability, electrostatic charge and electromagnetic interference issues, and materials outgassing.
Douglas W. Cooper, H.L. Wolfe, et al.
Annual Technical Meeting of Institute of Environmental Sciences 1989
Chung-Hsun Lin, R. Kambhampati, et al.
VLSI Technology 2012
Da-Yuan Shih, Helen L. Yeh, et al.
IEEE Transactions on Components, Hybrids, and Manufacturing Technology
M.J. Rooks, G.M. Cohen, et al.
Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures