DRAM technologies for today's market and future DRAM generations
W. Neumueller, J. Alsmeier, et al.
ESSDERC 1997
Decomposition of SiO2 films on Si(100) during ultrahigh-vacuum anneal has been shown previously to be preceded, at low anneal temperatures, by electrical defect creation in metal-oxide-semiconductor structures. In this letter, the presence of stacking faults in a Si substrate is shown to be related to enhanced oxide decomposition during high-temperature anneal. Decomposition is enhanced because of the creation of a larger number of nucleation centers for the formation of volatile SiO. These nucleation centers are the result of the metals gettered in the stacking faults close to the SiO2/Si interface.
W. Neumueller, J. Alsmeier, et al.
ESSDERC 1997
M. Liehr, F.K. LeGoues, et al.
JVSTA
D.S. Wen, W.H. Chang, et al.
VLSI-TSA 1991
S.R. Kasi, M. Liehr, et al.
Applied Physics Letters