PaperSilylation of resist materials using di- and polyfunctional organosilicon compoundsE. Babich, J. Paraszczak, et al.Microelectronic Engineering
PaperKinetic model for the chemical vapor deposition of tungsten in the silane reduction processJulian J. HsiehJournal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Conference paperFormation mechanism and suppression methods of copper dendrites in BEOL integrationShaoning Yao, Wei-Tsu Tseng, et al.ADMETA 2011
