Conference paper
Interconnect and substrate modeling and analysis: An overview
E. Chiprout
BCTM 1997
An overview of the recent advances in model reduction techniques of linear interconnect and packaging models for the purpose of simulation is given. The importance of different methods for accuracy, stability, and generality are highlighted.
E. Chiprout
BCTM 1997
A.E. Ruehli, E. Chiprout
IEEE Topical Meeting EPEPS 1995
Tuyen V. Nguyen, A. Devgan
ICCAD 1997
Tuyen V. Nguyen, Jing Li
ICCAD 1997