Conference paper
Random walks in a supply network
Haifeng Qian, Sani R. Nassif, et al.
DAC 2003
In this brief, a temperature-and variation-aware electromigration analysis (T-VEMA) tool for power grid wires is described. First, T-VEMA performs a two-stage interconnect thermal analysis on a full chip. Next, the tool extracts the effective jL product values and performs an electromigration (EM) lifetime calculation on ideally manufactured mortal wires on the basis of thermal effects. Finally, T-VEMA analyzes process variation effects on EM reliability at global and local levels and reports variation tolerances of EM-sensitive power grid wires.
Haifeng Qian, Sani R. Nassif, et al.
DAC 2003
Sani R. Nassif, Zhuo Li
ISQED 2005
Anand Ramalingam, Frank Liu, et al.
ISQED 2006
Sani R. Nassif, Gi-Joon Nam, et al.
ISQED 2013