Asen Asenov, Binjie Cheng, et al.
IEEE T-ED
In this brief, a temperature-and variation-aware electromigration analysis (T-VEMA) tool for power grid wires is described. First, T-VEMA performs a two-stage interconnect thermal analysis on a full chip. Next, the tool extracts the effective jL product values and performs an electromigration (EM) lifetime calculation on ideally manufactured mortal wires on the basis of thermal effects. Finally, T-VEMA analyzes process variation effects on EM reliability at global and local levels and reports variation tolerances of EM-sensitive power grid wires.
Asen Asenov, Binjie Cheng, et al.
IEEE T-ED
Hailin Jiang, Malgorzata Marek-Sadowska, et al.
ICCD 2005
Shayak Banerjee, Kanak B. Agarwal, et al.
CICC 2011
Sani R. Nassif, Onsi Fakhouri
SLIP 2002