S.C. Lien, C. Cai, et al.
Japanese Journal of Applied Physics, Part 2: Letters
The microstructure and Cu distribution were determined for blanket and patterned Al(≤4 wt % Cu) thin films as a function of annealing. The growth of Θ-phase (Al2Cu) precipitates in blanket and patterned submicrometer-wide lines was quantified along with the Cu concentrations within the Al grains. The reliability of 0.5-μm-wide lines was found to be strongly influenced by the details of the annealing sequence; however, 1-μm-wide lines were less affected. The difference in the electromigration behavior of 0.5-μm-wide lines is shown to be due to the different film microstructures formed in the patterned lines as a function of annealing history. Specifically, the amount of Cu in the grains and the size and distribution of the Θ-phase precipitates were found to be a strong function of both the annealing conditions and the linewidth in 0.5-1-μm-thick Al(Cu) films.
S.C. Lien, C. Cai, et al.
Japanese Journal of Applied Physics, Part 2: Letters
A.S. Özcan, K.F. Ludwig Jr., et al.
Thin Solid Films
J.M.E. Harper, K.P. Rodbell, et al.
MRS Spring Meeting 1997
E.G. Colgan, B.K. Furman, et al.
ICNMM 2006