Conference paper

01 Jan 1991

The study of the Cu/Al/Au thin film system by electron microscopy

Paper

Tantalum as a diffusion barrier between copper and silicon: Failure mechanism and effect of nitrogen additions

Karen Holloway, Peter M. Fryer, et al.

Journal of Applied Physics

Paper

Effects of substrate temperature on copper distribution, resistivity, and microstructure in magnetron-sputtered Al-Cu films

K.Y. Ahn, T. Lin, et al.

Thin Solid Films

Paper

Stresses and radiation damage in Ar⁺ and Ti⁺ ion-implanted silicon

P.B. Madakson, J. Angilello

Journal of Applied Physics

Paper

Processing of La_1.8Sr_0.2CuO₄ and YBa ₂Cu₃O₇ superconducting thin films by dual-ion-beam sputtering

P.B. Madakson, J.J. Cuomo, et al.

Journal of Applied Physics

View all publications