Manabu Kodate, Eisuke Kanzaki, et al.
EURODISPLAY 2002
The thermal design and performance of the system packaging for a 300 mm wafer scale system is described. The system, which was water cooled, had a total thermal maximum design power of approximately 27 kW. The cooling system consisted of a silicon microchannel cooler, upper and lower cold plates, and (90) heat spreaders. The system packaging had a layered structure with laminates and power conversion components attached to the wafer mounted to the microchannel cooler, a lower layer consisting of pluggable vertical I/O cards and a large I/O planar board above which was an upper layer of pluggable high-voltage vertical cards and a large high-voltage planar. Additionally, eight external I/O cards, which plugged onto the I/O planar board, provided optical links to and from the system.
Manabu Kodate, Eisuke Kanzaki, et al.
EURODISPLAY 2002
Hazar Yueksel, Ramon Bertran, et al.
MLSys 2020
Jinghan Huang, Hyungyo Kim, et al.
MICRO 2025
Laura Bégon-Lours, Mattia Halter, et al.
MRS Spring Meeting 2023