Masanori Murakami, J.H. Basson
Journal of Applied Physics
The preceding paper pertains to studies which were carried out for Pb-In-Au films without overlying SiO layers. Because use is made of configurations in Josephson junction integrated circuits presently under investigation in which Pb-In-Au base-electrode films are coated by overlying layers of SiO, a study was undertaken of the effects of such layers on the strain behavior of Pb-In-Au films using an x-ray diffraction technique. Pb-12 wt. % In-4 wt. % Au films were prepared at 298 or 77 K to obtain large or fine grains, respectively, and then thermally cycled between 300 and 4.2 K and between 300 and 350 K. In large-grained Pb-In-Au films, the strain relaxation, upon thermal cycling, by dislocation glide or by grain-boundary diffusion creep, was observed to be significantly inhibited by overlying SiO layers. However, in fine-grained films, that was not observed. For junctions in which the tunnel oxide is formed within an opening in an overlying SiO layer, it is believed, e.g., that upon heating, a compressive strain gradient develops in the large-grained base-electrode films between the junction area and its surrounding, leading to base-electrode deformation inside the opening that could rupture the tunnel oxide. This study indicates that the strain gradient should be reduced by reducing the average grain size of the base-electrode films. These results agree well with the previous experimental results in which no hillocks were detected by scanning electron microscopy inside similar SiO-layer openings above fine-grained Pb-In-Au films during repeated thermal cycling between 300 and 4.2 K or upon heating from 300 to 343 K.
Masanori Murakami, J.H. Basson
Journal of Applied Physics
Masanori Murakami, W.H. Price, et al.
Journal of Applied Physics
Masanori Murakami
Critical Reviews in Solid State and Materials Sciences
Masanori Murakami
Thin Solid Films