Structured cold point thermoelectric coolers
Uttam Ghoshal
Device Research Conference 2002
This letter introduces the concept of a thermoelectromechanical cooler (TEMC), which modifies a traditional thermoelectric cooler (TEC) by using intermittent contact of a mechanical element synchronized with an applied pulsed current. Using Bi2Te3 as the thermoelectric material, it is predicted that the maximum temperature drop across a TEMC operated under zero applied heat flux is about 35% higher than that of a TEC. This effectively increases the thermoelectric figure of merit for maximum temperature differential applications by a factor of 1.8. © 1999 American Institute of Physics.
Uttam Ghoshal
Device Research Conference 2002
D. Gupta, B. Amrutur, et al.
IEEE TAS
Uttam Ghoshal, Y.S. Ju, et al.
ICTEC 1999
P.I. Oden, A. Majumdar, et al.
Journal of Tribology