D. Gupta, B. Amrutur, et al.
IEEE TAS
This letter introduces the concept of a thermoelectromechanical cooler (TEMC), which modifies a traditional thermoelectric cooler (TEC) by using intermittent contact of a mechanical element synchronized with an applied pulsed current. Using Bi2Te3 as the thermoelectric material, it is predicted that the maximum temperature drop across a TEMC operated under zero applied heat flux is about 35% higher than that of a TEC. This effectively increases the thermoelectric figure of merit for maximum temperature differential applications by a factor of 1.8. © 1999 American Institute of Physics.
D. Gupta, B. Amrutur, et al.
IEEE TAS
Joel Silberman, Naoaki Aoki, et al.
IEEE Journal of Solid-State Circuits
Uttam Ghoshal, Y.S. Ju, et al.
ICTEC 1999
D.P. LaPotin, Uttam Ghoshal, et al.
ISPD 1997