Nauman Z. Butt, Kevin McStay, et al.
IEDM 2010
Conference paper
Three dimensional dynamic random access memory
Abstract
We review high-density embedded 3D DRAM cache, industry 3D stacked DDR3 and wide IO mobile DRAM along with more recent Hybrid-Memory Cube (HMC) and High-Bandwidth Memory (HBM). © 2014 IEEE.
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