Skip to main content
Research
  • Blog
  • Publications
  • Careers
  • Focus areas
  • Semiconductors
  • Artificial Intelligence
  • Quantum Computing
  • Hybrid Cloud
  • About
  • Overview
  • Labs
  • People
  • Semiconductors
  • Artificial Intelligence
  • Quantum Computing
  • Hybrid Cloud
  • Overview
  • Labs
  • People
IBM logo
Research
  • Focus areas
    • Semiconductors
    • Artificial Intelligence
    • Quantum Computing
    • Hybrid Cloud
  • Blog
  • Publications
  • Careers
  • About
    • Overview
    • Labs
    • People
Journal of the IEICE
Paper
01 Aug 2015

Wafer bumping technologies

Related

Conference paper

Flip Chip Joining with Injection Molded Solder Technology

Takashi Hisada, Toyohiro Aoki

EDTM 2023

Conference paper

Solder and Organic Adhesive Hybrid Bonding Technology with Non-strip Type Photosensitive Resin and Injection Molded Solder (IMS)

Keiji Matsumoto, Takahito Watanabe, et al.

ECTC 2022

Conference paper

Volume-controllable Solder Bumping Technology to Package Substrate Using Injection Molded Solder for Fine-pitch Flip Chip

Toyohiro Aoki, Katsuyuki Sakuma, et al.

ECTC 2023

Conference paper

Thermomechanical Analysis on Stress Mitigation of FCPBGA with Low Melting Temperature Solder and Low Elastic Modulus Cu Pillar

Takashi Hisada, Sayuri Kohara, et al.

ICEP 2022

View all publications
  1. Home
  2. ↳ Publications

Date

01 Aug 2015

Publication

Journal of the IEICE

Authors

  • Toyohiro Aoki
IBM-affiliated at time of publication

Share

IBM Logo
  • Focus areas

    • Semiconductors
    • Artificial Intelligence
    • Quantum Computing
    • Hybrid Cloud
  • Quick links

    • About
    • Publications
    • Blog
    • Events
  • Work with us

    • Careers
    • Contact Research
  • Directories

    • Topics
    • People
    • Projects
  • Follow us

    • Newsletter
    • X
    • LinkedIn
    • YouTube
  • Contact IBM
  • Privacy
  • Terms of use
  • Accessibility