Electromigration and current-carrying implications for aluminum-based metallurgy with tungsten stud-via interconnections
- H.S. Rathore
- R. Filippi
- et al.
- 1992
- SPIE Microelectronic Processing 1992
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39 results for Thomas Kwok
Effect of strain on diffusion kinetics and activation energy for al grain-boundary diffusion: A computer simulation
- Thomas Kwok
- 1992
- SPIE Microelectronic Processing 1992
Electromigration in VLSI metallization (Invited Paper)
- T. Kwok
- 1991
- SPIE Microelectronic Processing Integration 1991
Electromigration in a two-level Al-Cu interconnection with W studs
- T. Kwok
- C. Tan
- et al.
- 1990
- VMIC 1990
MICROSTRUCTURE STUDIES OF Al-Cu SUBMICRON INTERCONNECTION.
- T. Kwok
- C.-Y. Ting
- et al.
- 1984
- VMIC 1984
ELECTROMIGRATION STUDIES OF Al-INTERMETALLIC STRUCTURES.
- P.S. Ho
- T. Kwok
- et al.
- 1983
- SSDM 1983
A web-based and email driven electronic contract management system
- Thomas Kwok
- Thao Nguyen
- et al.
- 2007
- ICEBE 2007
An enterprise electronic contract management system using dual XML and secure PDF documents
- Thomas Kwok
- Thao Nguyen
- 2006
- EDOC 2006
The Microstructure of Transition Metal/Al(Cu) Layers
- H.-C.W. Huang
- M. Wittmer
- et al.
- 2019
- JES
Electromigration in metals
- Paul S Ho
- Thomas Kwok
- 1999
- Reports on Progress in Physics