Characterization of plated Cu thin film microstructures
- L. Gignac
- K.P. Rodbell
- et al.
- 1999
- MRS Spring Meeting 1999
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38 results for P.C. Andricacos
Mechanisms for microstructure evolution in electroplated copper thin films
- J.M.E. Harper
- C. Cabral Jr.
- et al.
- 1999
- MRS Spring Meeting 1999
Hot topics in electrodeposition
- Andrew A. Gewirth
- Panos C. Andricacos
- et al.
- 1998
- Electrochemical Society Interface
Future directions in electroplated materials for thin-film recording heads
- P.C. Andricacos
- N. Robertson
- 1998
- IBM J. Res. Dev
Damascene copper electroplating for chip interconnections
- P.C. Andricacos
- C. Uzoh
- et al.
- 1998
- IBM J. Res. Dev
Composition Determination of NiCo Alloys by the RRDE Method
- P.C. Andricacos
- 1995
- JES
Electrochemical Fabrication of Mechanically Robust PbSn C4 Interconnections
- J. Roeder
- H. Deligianni
- et al.
- 1995
- JES
Alloying of a Less Noble Metal in Electrodeposited Cu Through Underpotential Deposition
- Hariklia Deligianni
- I-Chia Hsu Chang
- et al.
- 1995
- JES
Behavior of Cu(P) and Oxygen Free High Conductivity Cu Anodes under Electrodeposition Conditions
- H.S. Isaacs
- A.G. Schroft
- et al.
- 1993
- JES
The Influence of Lithographic Patterning on Current Distribution in Electrodeposition: Experimental Study and Mass-Transfer Effects
- H.Y. Cheh
- J. Dukovic
- et al.
- 1993
- JES