Integrity of ceramic packages upon liquid nitrogen cycling
- Ho-Ming Tong
- H.L. Yeh
- et al.
- 1989
- ECTC 1989
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6 results for Helen L. Yeh
Factors Affecting the Interconnection Resistance and Yield in Multilayer Polyimide/Copper Structures
- Da-Yuan Shih
- Helen L. Yeh
- et al.
- 1993
- IEEE Transactions on Components, Hybrids, and Manufacturing Technology
Effects of Parylene Coating on the Thermal Fatigue Life of Solder Joints in Ceramic Packages
- Ho-Ming Tong
- Lawrence S. Mok
- et al.
- 1993
- IEEE Transactions on Components, Hybrids, and Manufacturing Technology
Ceramic Packages for Liquid-Nitrogen Operation
- Ho-Ming Tong
- Helen L. Yeh
- et al.
- 1989
- IEEE T-ED
Ambient dependence of metal diffusion through a less-electronegative metal layer
- Chin-An Chang
- Helen L. Yeh
- 1986
- Applied Physics Letters
Thermal dry process soldering
- S.K. Ray
- H.L. Yeh
- 1986
- JVSTA