Laser release process to obtain freestanding multilayer metal-polyimide circuits
- F.E. Doany
- C. Narayan
- 1997
- IBM J. Res. Dev
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Thin Film Transfer Process for Low Cost MCM-D Fabrication
- C. Narayan
- S. Purushothaman
- et al.
- 1995
- IEEE Transactions on Components Packaging and Manufacturing Technology Part B
Factors Affecting the Interconnection Resistance and Yield in Multilayer Polyimide/Copper Structures
- Da-Yuan Shih
- Helen L. Yeh
- et al.
- 1993
- IEEE Transactions on Components, Hybrids, and Manufacturing Technology