High performance 0.13 μm SOI CMOS technology with Cu interconnects and low-k BEOL dielectric
- P. Smeys
- V. McGahay
- et al.
- 2000
- VLSI Technology 2000
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Process window metrology
- Christopher P. Ausschnitt
- W. Chu
- et al.
- 2000
- SPIE Advanced Lithography 2000
Mechanism of the ultraviolet laser ablation of polymethyl methacrylate at 193 and 248 nm: Laser-induced fluorescence analysis, chemical analysis, and doping studies
- R. Srinivasan
- Bodil Braren
- et al.
- 1986
- Journal of the Optical Society of America B: Optical Physics