Integrity of ceramic packages upon liquid nitrogen cycling
- Ho-Ming Tong
- H.L. Yeh
- et al.
- 1989
- ECTC 1989
Publications
Date
Featured collections
Popular topics
5 results for Kamalesh K. Srivastava
Chip to carrier C4 technology challenges with Pb-free solders
- Eric D. Perfecto
- Brian Sundlof
- et al.
- 2008
- CICC 2008
C4NP technology: Present and future
- Eric Perfecto
- Da-Yuan Shih
- et al.
- 2008
- GBC 2008
Effects of Parylene Coating on the Thermal Fatigue Life of Solder Joints in Ceramic Packages
- Ho-Ming Tong
- Lawrence S. Mok
- et al.
- 1993
- IEEE Transactions on Components, Hybrids, and Manufacturing Technology
Ceramic Packages for Liquid-Nitrogen Operation
- Ho-Ming Tong
- Helen L. Yeh
- et al.
- 1989
- IEEE T-ED