Extendibility study of a PVD Cu seed process with Ar+ Rf-Plasma enhanced coverage for 45nm interconnects
- Andrew H. Simon
- Tibor Bolom
- et al.
- 2008
- MRS Spring Meeting 2008
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6 results for B. Baker
Effect of impurity on Cu electromigration
- C.-K. Hu
- Matthew Angyal
- et al.
- 2010
- International Workshop STRESS-INDUCED PHENOMENA IN METALLIZATION 2010
Metallization opportunities and challenges for future back-end-of-the-line technology
- Cyril Cabral Jr.
- Benjamin Fletcher
- et al.
- 2010
- ADMETA 2010
Morphology of electrodeposited Cu on 300 mm PEALD Ru substrates
- J. Kelly
- T. Vo
- et al.
- 2008
- ECS Meeting 2008
Impact of Cu microstructure on electromigration reliability
- C.-K. Hu
- L. Gignac
- et al.
- 2007
- IITC 2007
Uniform copper electroplating on resistive substrates
- Rui Fang
- Keisuke Namiki
- et al.
- 2004
- ECS Meeting 2004