Removal of Fluorocarbon Residues on CF4/H2 Reactive-ion-Etched Silicon Surfaces Using a Hydrogen PlasmaJ. SimkoG.S. Oehrleinet al.2019JES
Thermal stress-induced and electromigration-induced void-open failures in Al and Al-Cu fine linesT. KwokK.K. Chanet al.1991Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films